TerraFill® low resistivity grounding backfill provides a simple method to substantially lower the earth resistance of grounding systems. When used with copper grounding equipment, contact resistance to earth is lowered by up to 63%. TerraFill® produces lower steady state and stable ground impedance, resulting in a reliable, low resistance, electrical connection between the grounding system and the earth. ALLTEC’s TerraFill® produces lower surge impedance resulting in faster transient dissipation. Manufactured from environmentally safe and stable materials, TerraFill® excellent shelf life and long-term storage has no performance effects.
Excellent shelf life with long-term performance
Will not dissolve or decay with time
Maintains consistent resistance for the life of the system