TerraFill

TerraFill® Ground Enhancing Backfill

TerraFill® low resistivity grounding backfill provides a simple method to substantially lower the earth resistance of grounding systems. When used with copper grounding equipment, contact resistance to earth is lowered by up to 63%. TerraFill® produces lower steady state and stable ground impedance, resulting in a reliable, low resistance, electrical connection between the grounding system and the earth. ALLTEC’s TerraFill® produces lower surge impedance resulting in faster transient dissipation. Manufactured from environmentally safe and stable materials, TerraFill® excellent shelf life and long-term storage has no performance effects.

Easily applied
Excellent shelf life with long-term performance
Will not dissolve or decay with time
Maintenance free
Maintains consistent resistance for the life of the system

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TerraFill® Applications

TerraFill® creates a reliable, low resistance electrical connection between the grounding system and the earth. It is manufactured to be compatible with copper grounding systems and standard field application methods. It can be used in connection with grounding grids to minimize step and touch potentials. You can view typical installation locations in the application maps to the right by locating the number 2.

How it Works

Manufactured to be compatible with copper grounding systems and standard field application methods
Can be used in connection with grounding grids to minimize step-and-touch potential
Versatile–applying TerraFill® to lower the ground resistance of grounding equipment allows for a variety of earthing designs which might otherwise be impractical
Self-compacting–comes in easily transportable 50 lb. (22.68 kg.) bags. Easily installed by one person.
Produces acceptable grounding impedance in high resistivity soils within a reasonably sized area